The causes of detachment between Ni and the substrate are:
Insufficient removal before electroplating; Most of the sheets will have a layer of antioxidant during processing, and the oxide film will cause poor coating if the oxide film is not removed, because the copper plating is first in the process, and it can be verified by confirming whether the copper-copper is separated. The solution is to remove the oxide film on the surface by brushing or anolysis and then electroplating.
If the nickel plating layer falls off from the copper plating layer, it may be caused by excessive nickel plating agent and excessive tensile stress of the nickel plating.
In addition, too high pH value will also cause nickel plating peeling, control the pH between 3.5-4.5 (depending on the nature of the light agent), but also consider whether the light agent system is suitable, it is recommended to use semi-gloss system light agent.
The high organic impurities or metal impurities of the nickel plating solution will also cause the stress of the nickel plating layer to be too high, which can be removed by weak electrolysis or activated carbon.
If it is Sn-Ni shedding, it may be:
After nickel plating, it is recommended not to stay in air or water for too long, it is recommended not to exceed 1 minute.
The nickel plating agent is unbalanced, and the coating stress is too large, so it is recommended to use a single dosage semi-gloss agent.
